Hanic propels Malaysia’s semiconductor value chain with new IC design and advanced packaging hub in Penang

• Expansion expected to create more than 60 high-value engineering roles
• New centre to focus on AI-driven chip architectures and heterogeneous integration

Singapore-headquartered semiconductor company Hanic is expanding its presence in Penang with a new hub focused on integrated circuit (IC) design and advanced packaging. The move strengthens Malaysia’s semiconductor value chain and reinforces Penang’s role as a key regional hub for semiconductor innovation.

Supported by InvestPenang, the new centre will focus on high-growth areas such as AI-driven chip architectures and next-generation heterogeneous integration. By combining front-end IC design with back-end and advanced packaging capabilities, Hanic aims to offer a seamless end-to-end design solution that shortens time-to-market for customers in the data centre, edge AI, automotive and communications sectors.

The expansion is expected to create more than 60 high-value engineering jobs, including roles in digital and analogue design, design verification, physical design and advanced 2.5D/3D packaging technologies.

Chief minister of Penang, Chow Kon Yeow, said the investment supports the state’s efforts to move further up the semiconductor value chain. “Building on five decades of industrial excellence, Penang continues to strengthen its position as the Silicon Valley of the East by advancing into next-generation technologies. Hanic’s investment in IC design and advanced packaging aligns strongly with Malaysia’s National Semiconductor Strategy to deepen front-end design capabilities and enhance advanced packaging competencies.

“Through initiatives such as Penang Silicon Design @5KM+ (PSD@5KM+), we are building an integrated ecosystem that connects design, testing and manufacturing. Hanic’s presence will enhance our innovation capacity, create high-value talent opportunities and generate positive technological spillovers for the state,” he added.

Dr Oh Ser Wah, general manager of Hanic, said Penang offers a strong combination of manufacturing expertise and a growing semiconductor design ecosystem. “Penang offers a unique synergy of decades-long electronics manufacturing excellence and a rapidly expanding design ecosystem. With Hanic’s track record, including delivering a 3D IC solution for a major regional market, our expansion here positions us close to key partners and talent within Southeast Asia’s semiconductor ecosystem.

“With the support of InvestPenang, we are committed to nurturing local talent and driving innovation in IC design and advanced packaging technologies that will support the next generation of computing performance.”

Hanic’s Penang office is currently ramping up hiring across multiple disciplines, including system-on-chip design, design verification, physical design, design-for-test and advanced packaging.

The company is also engaging industry partners to define future roadmaps for advanced packaging development in Malaysia.